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Fabrication line class 10-100 cleanroom (560m2)

  • Magnetron sputtering Metallization: MRC Eclipse
  • Diffusion: Centrotherm furnace
  • LPCVD: Centrotherm reactors
  • CCP PECVD: STS
  • ICP PECVD
  • Projection lithography: Suss MA150BSA Single & double side
  • Stepping i-line lithography: Nikon Mod. NSR-2205i11D
  • e-beam lithography
  • Ion Implantation: Varian E220
  • Dry etching: TEGAL 6510, TEGAL 900
  • Deep Reactive Ion Etching: Alcatel AMS200
  • Wet etching