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Facilities

• 6” Microfabrication Area
• 700 m2 ISO 4-5, full CMOS pilot line, DRIE, wafer bonder, electroplating, bulk micromachining
• Testing Area
• 200 m2: manual, automatic electrical testing, optical testing, PV cells efficiency
• Integration and packaging area
• 60 m2: microassembly, screen printing, ball & wedge bonding, pull & shear test, CNC micromill