You are here

Packaging lavoratory

  • Wafer Bonding  AML:
     - Si fusion bonding
     - Anodic bonding
     - Au-Si eutectic bonding
     - Glas frit bonding
     - Adhesive bonding
 
• Screen Printer (AurelVS1520A ) 
• Wafer Dicing: Disco DAD 2H/6T 
• Assembly Station Tresky