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Bulk MEMS

Image: 
Principal FBK-CMM research investigator is the MST Unit.

Deep 3D micromechanical  structures are fabricated using DRIE and TMAH etching. Suspended structures are used for heat transfer devices (flow measurement), microheaters and strain sensors (pressure measurement). Silicon complex structures can be realized with multi-level DRIE processing. Microfluidics chips and molds can be realized with multilevel deep silicon etching allowing both large area channels and sharp features (aspect ratio 1/20) on the same chip.

- Wafer-through with multiple levels
- Double side process
- Piezoresistive transduction
- Microfluidics molds

Technology type: 
MEMS
Application cases: 
pressure sensors, accelerometers, flow sensors, micrometer accuracy vibrating structures and complex molds