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Surface MEMS

Principal FBK-CMM research investigator is the MST Unit.

we have deep expertise in surface micromachined structures, using either electroplated metal or PECVD dielectric low stress structural layers. RF switch devices are available on a fully characterized multy-project wafer platform with standard design rules.

- Back-end module
- Temperature below 400C
- Ultra low stress dielectric layers
- Capacitive actuation
- Metal and polymer sacrificial layer

Technology type: 
Application cases: 
RF switches, ultrasonic transducers (CMUT)
Market area: 
Sensors and transducers